旋流式微通道热沉传热特性研究

Investigation of Heat Transfer Characteristics of a Swirl Flow Microchannel Heat Sink

随着微电子设备高度集成化和小型化发展,电子器件发热量增加,其热管理问题是目前的研究热点。本文针对旋流式微通道热沉传热和流动特性开展了数值模拟的研究,讨论了冷却剂流量和均热板材料导热系数的影响。研究结果表明,与常规微通道不同,随冷却剂流量增加,旋流式微通道热沉内冷却剂旋律程度增强,流程增加,导致高温向热沉中心出口位置迁移,高低温差降低。热沉底部均热材料导热系数增加时,加热面上方径向和周向导热增强,导致加热面平均温度和高低温差降低。

The development of highly integrated and miniaturized microelectronic devices leads to an increasing amount of heat generated by electronic devices.Consequently,thermal management has become a significant research subject.This paper aims to investigate the heat transfer and flow characteristics of the swirl-flow microchannel heat sink through numerical simulations.Additionally,the effects of coolant flow rate and thermal conductivity of the solid material are discussed.The results indicate that,different from conventional microchannels,the flow patch of coolant increases with increasing of flow rate due to the enhanced swirl flow.This results in the migration of high temperature region to the exit position of the heat sink center and the decrease in the temperature difference.On the other hand,when the thermal conductivity of the heat sink increases,the radial and circumferential heat conduction is enhanced,resulting in a decrease in the average temperature of the heating surface and the high-low temperature difference.