电机封装用改性环氧树脂胶粘剂绝缘与导热性分析

Insulation and thermal conductivity analysis of modified epoxy adhesives for motor packaging

为提升环氧树脂胶粘剂的导热性能,为电机绝缘封装材料建立一个优良的导热环境,研究通过KH560偶联剂对h-BN导热材料实施改性处理,并将经过改性处理的h-BN导入桐马环氧胶结剂并制备出h-BN/EP复合材料。为验证该材料的应用性能,采用扫描电子显微镜、稳态热流仪等设备来分析该材料的表现微观形貌、导热性能和绝缘性能。经试验研究发现,当h-BN填量达到30%时,复合材料的导热率可达到0.424W/(m·K),相较纯环氧树脂增加了170.2%,且击穿电场与纯环氧树脂相当。说明该材料在有效提升环氧树脂导热性能的同时保留了其优良的绝缘性能,具有一定的应用价值。

In order to improve the thermal conductivity of epoxy resin adhesive and establish an excellent thermal conductivity environment for motor insulation packaging materials,the modification of h-BN thermal conductive materials by KH560 coupling agent was studied,and the modified h-BN was introduced into Tongma epoxy binder to prepare h-BN/EP composites.To verify the application performance of the material,scanning electron microscopy,steady-state heat flux meter and other equipment were used in this study to analyze the microstructure,thermal conductivity,and insulation performance of the material.Through experimental research,it was found that when the h-BN filling amount reached 30%,the thermal conductivity of the composite material could reach 0.424 W/(m·K),which increased by 170.2%compared to pure epoxy,and the breakdown electric field was equivalent to that of pure epoxy.It shows that the material can effectively improve the thermal conductivity of epoxy resin while retaining its excellent insulation properties,and has certain application value.