摘要
T/R组件是有源相控阵天线构成的重要组成部分,多芯片集成技术在T/R组件上的广泛应用,使长期使用的可靠性成为至关重要的问题。对于多芯片T/R组件的长期可靠性评估,加速寿命试验是最常用的方法。本文选取典型多芯片T/R组件,分析整体结构和关键部位,确定试验敏感参数;通过结温测试得到其薄弱环节和试验条件;根据多应力评估试验法的基本原理,搭建试验平台,基于威布尔分布模型开展多应力加速寿命评估试验;试验分别选取85 ℃、105 ℃、125 ℃三个温度点,分析试验数据可知三个试验温度下样品参数变化趋势一致,因此不同试验温度下样品失效模式与失效机理是相同的。最后通过威布尔估计法进行寿命预计,并使用阿伦尼斯方程进行曲线拟合,得到了不同温度下的加速寿命曲线,为微波集成多芯片T/R组件可靠性分析及评价提供了参考依据。
T/R module is an important part of active phased array antenna.With the wide application of multi-chip integration technology in TR module,long-term reliability becomes a crucial issue.Accelerated life test is the most common method to evaluate the long-term reliability of multi-chip T/R module.In this paper,a typical multi-chip T/R module is selected to analyze the whole structure and key parts,and determine the test sensitive parameters.The weak links and test conditions were obtained by junction temperature test.According to the basic principle of the multi-stress evaluation test method,a test platform was built,and the multi-stress accelerated life evaluation test was carried out based on the Weibull model.Three temperature points of 85℃、105℃、125℃were selected respectively in the test.The analysis of test data showed that the variation trend of sample parameters under the three test temperatures was consistent.Therefore,the failure mode and failure mechanism of samples under different test temperatures were the same.Finally,life prediction was carried out by Weibull estimation method,and curve fitting was carried out by Arrhenis equation.Accelerated life curves at different temperatures were obtained,which provided a reference for reliability analysis and evaluation of microwave integrated multi-chip T/R module.
作者
周璐
ZHOU Lu(The 13th Research Institute,CETC,Shijiazhuang 050051)
出处
《环境技术》
2024年第4期131-138,共8页
Environmental Technology
