PCB阻焊前后阻抗变化研究

Study on impedance change of PCB before and after solder resist

在印制电路板(PCB)制造过程中,需要适应当前越来越严苛的阻抗管控环境。对材料介电常数、阻抗规格、阻焊油墨介电常数及差分线路节距规格等影响因子进行数据分析,通过阻抗变化值来界定以上因素的影响程度,以此给出阻焊前PCB半成品阻抗管控方法。

In the printed circuit board(PCB)manufacturing process,it is needed to reduce the scrap rate and adapt to the current increasingly strict impedance control environment.This paper analyzes the data of the influence factors such as material dielectric constant,impedance specification,solder mask dielectric constant,and differential line pitch specification,and defines the influence degree of the above factors through the impedance change value,so as to give the impedance control method of PCB semi-finished products before solder resist.