摘要
Deep oil and gas reservoirs are under high-temperature conditions,but traditional coring methods do not consider temperature-preserved measures and ignore the influence of temperature on rock porosity and permeability,resulting in distorted resource assessments.The development of in situ temperaturepreserved coring(ITP-Coring)technology for deep reservoir rock is urgent,and thermal insulation materials are key.Therefore,hollow glass microsphere/epoxy resin thermal insulation materials(HGM/EP materials)were proposed as thermal insulation materials.The materials properties under coupled hightemperature and high-pressure(HTHP)conditions were tested.The results indicated that high pressures led to HGM destruction and that the materials water absorption significantly increased;additionally,increasing temperature accelerated the process.High temperatures directly caused the thermal conductivity of the materials to increase;additionally,the thermal conduction and convection of water caused by high pressures led to an exponential increase in the thermal conductivity.High temperatures weakened the matrix,and high pressures destroyed the HGM,which resulted in a decrease in the tensile mechanical properties of the materials.The materials entered the high elastic state at 150℃,and the mechanical properties were weakened more obviously,while the pressure led to a significant effect when the water absorption was above 10%.Meanwhile,the tensile strength/strain were 13.62 MPa/1.3%and 6.09 MPa/0.86%at 100℃ and 100 MPa,respectively,which meet the application requirements of the self-designed coring device.Finally,K46-f40 and K46-f50 HGM/EP materials were proven to be suitable for ITP-Coring under coupled conditions below 100℃ and 100 MPa.To further improve the materials properties,the interface layer and EP matrix should be optimized.The results can provide references for the optimization and engineering application of materials and thus technical support for deep oil and gas resource development.
基金
supported by the Sichuan Science and Technology Program (Grant Nos.2023NSFSC0004,2023NSFSC0790)
the National Natural Science Foundation of China (Grant Nos.51827901,52304033)
the Sichuan University Postdoctoral Fund (Grant No.2024SCU12093)。