摘要
MEMS的高能量密度驱动和IC高度集成使MEMS器件产生较强的热效应,影响了MEMS器件的稳定性和寿命。传统的致冷器与待致冷器件是相对独立的器件,无法满足MEMS器件局部有效致冷和系统集成的要求。介绍了一种新型铁电薄/厚膜MEMS微致冷器的原理和设计,探讨其作为MEMS致冷器的可行性,该致冷器可以在较大工作温度范围内,对基于IC硅工艺的MEMS器件和普通IC芯片进行致冷。
The thermal effect of MEMS is a critical issue for its feasible application because high density power and IC chip are needed in MEMS. Traditional micro-cryogenic system is not practical in MEMS application as it apart from the elements of MEMS. It is not effective for local cooling and the integration of the system.The principles and design of a new micro-cryogenic system are presented and its feasibility is studied.The refrigerator has wide range of operating temperature and could be used for cooling the MEMS devices based on IC Si-processing technologies and general IC chips.
出处
《微细加工技术》
2003年第4期51-56,共6页
Microfabrication Technology
基金
中国科学院"引进国外杰出人才基金"2001年资助项目(20011215)
国家863MEMS重大专项基金资助项目(2003AA404150)
