压接型IGBT器件多物理量测试方法综述

Overview of Measurement Methods of Multiple Physical Parameters in Press Pack IGBTs

压接型IGBT器件目前已广泛应用于智能电网的各类高压大容量电力换流和控制装备中,与焊接式IGBT模块相比,具有功率密度大、双面散热、失效短路、易于串联等优点。器件中芯片压力、结温、电流3个关键物理量相互耦合并直接表征器件的运行工况,因此对压接型IGBT器件多物理量测试方法的研究有利于解决器件内部多物理场耦合问题,指导设计更有效的器件封装结构,保障器件的可靠运行。压接型IGBT器件内部芯片排列紧密,且密闭在由集电极和发射极极板压接形成的内部空间中,这给器件内部多物理量测试带来了挑战。该文紧密围绕压接型IGBT器件中上述3个关键物理量及其分布性的测试,系统综述小尺度下压力量、温度量、电流量各种测试方法的最新进展,梳理其主要特点,对比其优缺点并探讨其在压接型IGBT器件中的局限性与适用性,在此基础上展望压接型IGBT器件多物理量测试的研究方向。

Press pack IGBTs have been widely used in various types of high-voltage and large-capacity power converters and control equipment in smart grids,which,compared with traditional IGBT modules,have the advantages of high power density,double-sided heat dissipation,failure short circuit,and easy series connection.The three key physical parameters of chip pressure,junction temperature and current are coupled to each other and directly characterize the operating conditions of the press pack IGBTs.The measurement method research of the multiple physical parameters of the press pack IGBTs is beneficial to solve the multiple physical coupling problems involved,guide the design of more effective device package structure,and ensure the reliable operation of the device.The internal chips of the press pack IGBTs are closely arranged and sealed in the space formed by the collector and the emitter plates,which brings challenges for the measurement of the multiple physical parameters inside the device.This paper was closely related to the measurement of above three key physical parameters and their distribution in press pack IGBTs,systematically summarized the latest progress of measurement methods of pressure,temperature and current at small scales,combined their main features and compared the advantages and disadvantages,and explored the limitations and applicability in press pack IGBTs.Finally,the future possible research topics of press pack IGBTs were expected.