铜浆在多层陶瓷封装外壳制备技术中的应用

Application of Copper Paste in Preparation Technology of Multilayer Ceramic Package

本文介绍了自制铜浆的组成和特点,探讨了铜浆在多层陶瓷封装外壳制备技术中的适用性。通过对铜浆微观形貌观察,方阻、剪切强度的测试,分析并讨论了玻璃相添加量、烧结温度、排胶温度、排胶时间对于铜浆性能的影响。研究发现,当烧结温度为850℃,玻璃相添加量为7wt.%时,铜浆表现出良好的导电性和较高的剪切强度,方阻为2.5mΩ/,剪切强度为45.7MPa。当排胶温度达到650℃,适当延长排胶时间,降低升温速率有利于促进埋层铜浆的致密化烧结,减少孔洞,从而改善多层陶瓷封装外壳的表面平整度。

This paper introduced the composition and characteristics of homemade copper paste used in the preparation of multilayer ceramic package.Through the observation of microstructure,sheet resistance and shear strength,we analyzed the influence of sintering temperature,glass powder content,rubber discharging temperature and discharging time on the properties of copper paste.The results show that the copper paste has excellent comprehensive performance when sintered at 850°C with 7 wt.%glass,the sheet resistance of 2.5 mΩ/■and shear strength of 45.7 MPa.Higher density copper paste with fewer holes was fabricated when the temperature reaches 650°C and discharging time is appropriately extended,which is good for improving the smoothness of multilayer ceramic package.