射频绝缘子与基板互连焊点热疲劳可靠性有限元模拟研究

Finite Element Analysis for Thermal Fatigue Reliability of Solder Joints between RF Insulator and Substrate

以焊点塑性应变范围为依据,通过有限元模拟法,结合ANAND本构方程和Coffin-Manson半经验方程,研究了微波产品射频绝缘子与基板互连的焊点在温度循环过程中的热疲劳可靠性。研究首先分析了焊点在高、低温阶段的形变情况以及应力应变分布情况,然后讨论了盒体、基板和垫片材料对焊点热疲劳可靠性的影响,最后分析了焊点结构对可靠性的影响。

Thermal Fatigue reliability of solder joints between RF insulator and substrate in microwave products was studied by using finite element analysis with Anand model and Coffin-Manson equation.The deformation of solder joints and the distribution of stress and strain at the high and low temperature were firstly analyzed.Then,the effect of packaging materials of can,substrate and spacer on the reliability of solder joints was discussed.The dimension of solder joint structure was also considered in this study in order to achieve qualified reliability.