BT材封装基板实现Fine line制作的研究

Research on the fabrication of fine line on BT packaging substrate

mSAP是在半加成法(Semi-Additive Process)工艺的基础上进行改良而得的一种精细线路制作技术,是IC载板的制造工艺之一,通常应用于BT类封装基板。目前mSAP流程最小线宽/间距能力在15/15μm左右。15μm以下线路主要在以ABF材料作为介质层的SAP流程和部分ETS埋线(Embedded Trace Substrate)流程中有实绩。以上两种流程通过降低线宽损失量,虽然实现了更精细线路的制作,但是大大提高了成本。本文将探讨优化贴膜、曝光、显影条件,提升干膜附着能力,通过在显影后水洗中添加MgSO4和显影后等离子降低干膜脚从而实现15μm以下线路的制作。

mSAP is a fine line manufacturing technology improved on the basis of Semi-Additive Process,which is one of the manufacturing processes of IC carrier board,usually used in BT package substrate.The current mSAP process minimum line width/pitch capability is around 15/15μm.Lines below 15μm are mainly used in SAP processes with ABF material as the medium layer and partially Embedded Trace Substrate processes.The above two processes reduce the amount of line width loss.Although the production of finer lines is achieved,but the cost is greatly increased.This paper will discuss the application of high resolution exposure equipment,optimize the development and postdevelopment plasma conditions,improve the dry film adhesion ability,reduce the dry film foot,so as to achieve the production of lines below 15μm.