HDI盲孔加工工艺研究

Research on HDI blind hole processing technology

盲孔在承接AI(Artificial Intelligence)服务器产品用高密度互连(High Density Interconnector,HDI)印制板层与层之间的导通上起到关键性作用。相比其他消费电子类HDI,AI服务器产品用HDI的盲孔具有高厚径比、孔径极差小、玻纤突出短等特点及特殊要求,为盲孔制程管控和CO_(2)激光加工技术带来更高挑战。本文围绕直径100~127μm的盲孔,研究了HDI盲孔前处理过程铜厚波动对孔径影响,分析了CO_(2)激光参数在加工不同孔径时的影响规律。最终提出了盲孔前处理过程铜厚管控标准,获得了典型盲孔孔径和介厚的最优激光参数,从而实现HDI盲孔高质量、高可靠性加工。

The blind via plays a pivotal role in the interconnection between layers of high-density interconnectors(HDI)printed boards for AI(artificial intelligence)server products.In comparison to other consumer electronics HDI,the blind via of HDI for AI server products exhibits distinctive characteristics and specific requirements,including a high thickness-diameter ratio,a small aperture tolerance,and a short glass fiber protrusion.These attributes present a significant challenge to blind via process control and CO_(2)laser processing technology.In this paper,by focusing on blind holes with a diameter of 100-127μm,the influence of copper thickness fluctuation on the aperture during the pretreatment of HDI blind via is studied,and the impact of CO_(2)laser parameters on different aperture is analyzed.Finally,a copper thickness control standard for the blind hole pretreatment process is proposed,and the optimal laser parameters for typical blind hole apertures and medium thicknesses are obtained.This is done in order to achieve high-quality and high-reliability processing of HDI blind via.