先进封装高速电镀铜柱的研究

Research on high-speed electroplated copper pillars for advanced packaging

作为先进封装的关键基础技术,电镀铜柱越来越受到重视。然而,高速电镀铜柱普遍存在表面平整性差的问题。本文从镀液设计和优化角度出发,采用计时电位法、线性扫描伏安法和电位阶跃法研究了不同整平剂的电化学行为,并利用全因子试验设计方法探究了电镀酸铜镀液中硫酸、硫酸铜和添加剂浓度对铜柱表面平整性的影响。研究结果表明,选择具有良好极化效果的整平剂并合理调控镀液组成,可在8 A/dm^(2)和15 A/dm^(2)的电流密度下获得表面平整性良好的铜柱。本研究结果可为高速电镀铜柱的整平剂设计和镀液优化提供指导。

Electroplated copper pillar,as a key enabling technology for advanced packaging,have gained increasing attention.However,poor surface flatness is a common problem in high-speed electroplated copper pillars.This paper investigates the electrochemical behavior of different leveling agents using chronoamperometry,linear sweep voltammetry,and potential step methods from the perspective of plating solution design and optimization.Furthermore,the influence of sulfuric acid,copper sulfate,and additive concentrations on the surface flatness of copper pillars is studied using full factorial experimental design method.The research results demonstrate that selecting leveling agents with good polarization effects and appropriately adjusting the plating solution composition can achieve copper pillars with excellent surface flatness at current densities of 8 and 15 A/dm^(2).These findings provide guidance for the design of leveling agents and the optimization of plating solutions for high-speed electroplated copper pillars.