mSAP图形填孔电镀薄板框的研究

Research on mSAP graphic hole filling electroplating thin plate frame

本文通过机理分析,确认垂直图形填孔电镀线均匀性能力提升的重点集中在板面一次电流分布。现有垂直图形填孔线光铜板电镀均匀性分布特点:两长方向距离板边60 mm区域范围内铜厚偏薄3~5μm。以电镀均匀性为基础,结合小车独特的薄板框设计,减少小车薄板框Bussing Bar导线(陪镀条)电流分担,增加板件长方向板边区域在电镀过程中边缘效应,提升长方向板边区域铜厚。最终实现:(1)电镀铜厚25μm的条件下,光铜板单板铜厚极差由5μm提升至小于4μm,单板极差均匀性Range由10%提升到7%;(2)图形板铜薄导致的DCR(直流电阻)不良率由0.35%降低到0.25%。

Through mechanism analysis,this article confirms that the focus of improving the uniformity of vertical pattern hole filling electroplating lines is on the distribution of primary current on the board surface.The uniform distribution characteristics of the existing vertical pattern hole filling line copper plate electroplating the copper thickness is 3-5μm thinner within a range of 60mm from the edge of the plate in two long directions.Based on the uniformity of electroplating and combined with the unique thin plate frame design of the car,the current sharing of the Bussing Bar(accompanying plating strip)in the thin plate frame of the car is reduced,the edge effect of the long direction plate edge area in the electroplating process is increased,and the copper thickness in the long direction plate edge area is improved.Final implementation Under the condition of electroplating copper with a thickness of 25μm,the copper thickness range of the single board of the bare copper plate is increased from 5μm to less than 4μm,and the uniformity range of the single board range is increased from 10%to 7%;The DCR(DC resistance)defect rate caused by thin copper on the graphics board decreased from 0.35%to 0.25%.