Mini LED灯珠载板45μm焊盘间距制作研究

Research on the fabrication of 45μm pad spacing on mini LED bead substrate

随着LED芯片及其封装工艺技术的突破,LED点间距正在实现微缩化,LED屏幕的分辨率与显示效果得到提升,从单色LED向全彩LED、小间距LED、Mini LED、Micro LED升级。Mini LED性能优势明显,拥有LED的传统优点,例如高分辨率、高亮度、良好色域、高对比度、高适应性等,同时更具有技术演进带来的可模块化拼接、扩展屏幕边界等优势。Mini LED灯珠载板指尺寸50~200μm的LED芯片或为该规格芯片组装成的灯珠提供电能、控制与支撑固定的PCB板,对应的焊盘间距在40μm到80μm之间。本文主要研究如何使用减成法工艺制作45μm焊盘间距Mini LED灯珠载板,通过对铜箔类型,铜厚控制,干膜厚度及解析度,曝光分辨率,蚀刻均匀性,蚀刻因子等一系列影响因素进行研究及提升,得出制作45μm焊盘间距灯珠载板的物料设备选择方案及加工参数。

With the breakthrough of LED chips and their packaging technology,the LED dot spacing is being miniaturized,and the resolution and display effect of LED screens have been improved,upgrading from monochrome LEDs to full-color LEDs,small-pitch LEDs,Mini LEDs,and Micro LEDs.Mini LED has obvious performance advantages,with the traditional advantages of LED,such as high resolution,high brightness,good color gamut,high contrast,high adaptability,etc.,and at the same time,it has the advantages of modular splicing and the screen boundary expanding brought by technological evolution.Mini LED bead carrier board refers to the size of 50-200μm LED chip or the assembled lamp bead assembled from the specification chip to provide power,control and support fixed PCB,and the corresponding pad spacing is between 40μm and 80μm.In this paper,a series of influencing factors such as copper foil type,copper thickness control,dry film thickness and resolution,exposure resolution,etching uniformity,etching factor are studied and improved,and the material equipment selection scheme and processing parameters for making 45μm pad spacing lamp bead carrier board are obtained..