超高铜厚超细间距平面线圈基板技术研究

Research on ultra-high copper thickness&ultra-fine spacing technology of FP-coil substrate

超高铜厚超细间距平面线圈基板的开发,可以在产品固有尺寸内,增加线圈匝数,实现更薄型化、更小型化的优点,同时还可以降低功耗,提升性能。本公司经过研究,通过半加成法工艺,在一次电镀形成一定较细间距的半成品,然后再通过二次电镀方式达到所需的铜厚,同时使得一次制作的线路间距变得更窄,从而实现更小间距的目的。另外在生产过程中增加特殊工艺流程,防止二次电镀铜厚增加时造成线间短路的风险,实现可量产的超高铜厚超细间距平面线圈基板。

The development of ultra-high copper thickness and ultra-fine pitch planar coil substrate can increase the number of coil turns within the natural size of the product,achieve thinner and smaller advantages,while reducing power consumption and improving performance.The company has studied,through the semi-addition process,in the fist plating to form a certain fine spacing of semi-finished products,and then through the secondary plating to achieve the required copper thickness,while making the line spacing of one production becomes narrower,so as to achieve the purpose of smaller spacing.In addition,special process flow is added in the production process to prevent the risk of short circuit between wires caused by the increase of copper thickness in the secondary electroplating,and the mass production of ultrahigh copper thickness and ultra-fine pitch planar coil substrate is realized.