112G通讯产品板制作关键技术探讨

Discussion on the key technology of manufacturing 112G communication product board

随着5G网络的扩展和6G技术发展快速推进,有线通讯产品单通道传输速率需求已从56 Gbps升级到112 Gbps。相比56 Gbps速率,112 Gbps速率下的通讯产品板需要更高可靠性、更低损耗的高速材料,要求更严的对准度,更高的厚径比,更严格的背钻精度,更好的阻抗控制精度等,这对PCB的加工技术与品质管控提出了更高的要求。本文主要基于一款32层112G通讯产品板,探讨其在棕化、压合、钻孔、除胶、电镀、背钻等工序制作关键技术,为112G通讯产品板的加工提供技术参考。

With the expansion of 5G networks and the rapid development of 6G technology,the single-channel transmission rate demand for wired communication products has been upgraded from 56Gbps to 112Gbps.Compared with 56Gbps rate,112Gbps communication product board needs higher reliability and lower loss of high-speed materials,requiring stricter alignment,higher thickness to diameter ratio,stricter back drilling accuracy,better impedance control accuracy,etc.,which puts forward higher requirements for PCB processing technology and quality control.This paper is mainly based on a 32-layer 112G communication product board,and discusses its key production technologies in the processes of brown-oxide,pressing,drilling,desmear,electroplating,back drilling,etc.,to provide technical reference for the processing of 112G communication product board.