超厚铜板关键制作工艺研究

Research on key manufacturing technology of super thick copper PCB

在高压大电流的新能源市场背景下,厚铜电源板的铜厚要求越来越厚,210μm以下的铜厚已不足以满足铜厚要求。文章针对于超厚铜多层板的两项关键工艺蚀刻和压合进行研究,通过理论分析超厚铜板的蚀刻规律,归纳出蚀刻能力模型以及线路补偿模型,并进行实验验证蚀刻补偿模型的有效性。针对于厚铜多层板的压合,文章对现有的超厚铜填胶缺胶问题进行分析,优化了超厚铜P片设计模型,解决了缺胶问题,同时还界定出超厚铜封闭无铜区大小。为超厚铜的制作提供了有力的工程技术指导。

In the context of the new energy market with high voltage and high current,the copper thickness requirements of the thick copper power supply board are getting thicker and thicker,and the copper thickness below 210μm is not enough to meet the copper thickness requirements.In this paper,two key processes,etching and pressing of super thick copper multilayer PCB are studied.Through theoretical analysis of the etching law of thick copper,the etching capacity model and trace line compensation model are summarized,and the effectiveness of the etching model is verified by experiments.For the pressing of thick copper multilayer PCB,the existing problem of lack of adhesive filling is analyzed,and the design model of prepreg is optimized to solve the problem of lack of adhesive.At the same time,the size of the enclosed copper-free zone by the super thick copper is defined.It provides powerful engineering technical guidance for the production of super thick copper.