脉冲波形对高厚径比通孔电镀的影响研究

Effect of pulse waveform on high thickness diameter ratio through hole electroplating

随着服务器、通讯类产品的高速发展,PCB产品呈现出孔小、板厚、线密、厚径比大的特点,纵深比由常规的11:1~15:1发展到20:1以上,甚至达到25:1~30:1。此要求对电镀制程提出了挑战,不仅要求孔内、面铜满足客户及标准要求,同时电镀可靠性也要满足要求。目前此类产品电镀加工方式为脉冲电镀,但是不同的脉冲条件对于产品品质影响不同,本文通过DOE实验,验证在不同的脉冲条件(时间比、电流比等)面铜、孔铜的不同结果,最终得出关于加工孔径0.15 mm,厚径比25:1以上产品的电镀参数。

With the rapid development of servers and communication products,PCB products show the characteristics of small holes,thick boards,dense lines,and large depth ratio,and the depth ratio has developed from the conventional 11:1~15:1 to more than 20:1,and even reached 25:1~30:1.This requirement poses a challenge to the plating process,which not only requires the inner and surface copper to meet customer and standard requirements,but also the plating reliability to meet the requirements.At present,the electroplating processing method of such products is pulse electroplating,but different pulse conditions have different effects on product quality.In this paper,DOE experiment was conducted to verify the different results of surface copper and pore copper under different pulse conditions(time ratio,current ratio,etc.),and finally obtain the electroplating parameters of products with a processing aperture of 0.15mm and a thickness ratio of 25:1 or more.