电磁热熔工艺的影响因素研究

Research on the influencing factors of electromagnetic hot-melting process

电磁热熔工艺通过电磁感应融化芯板之间的半固化片,实现层与层之间粘结的效果,是制作高层印制电路板的重要工艺之一。芯板和芯板之间的牢固粘结能够有效防止多层板在后续压合过程中发生偏位的情况,可以使用邦定结合力来量化这一指标。本文通过实验对邦定结合力的失效原因进行了分析,并确定电磁热熔工艺参数对于邦定结合力的影响,为提高多层板的热熔结合力以及防止后续压合层偏提供了一定的参考。

The electromagnetic hot-melting process melts the semi-cured sheets by electromagnetic induction to achieve the effect of connecting multi-layer boards,and is one of the most important processes for making high-level printed circuit boards.Firm bonding between core boards and core boards can effectively prevent multi-layer boards from being off-set in the subsequent press-fit process,which can be quantified using the adhesive strength between multi-layer.This paper analyzes the reasons for the failure of the adhesive strength between multi-layer through experiments and determines the influence of electromagnetic hot-melting process parameters on the adhesive strength,which provides a certain reference for improving the hot-melting adhesive strength force of multi-layer boards and preventing the deviation of subsequent press-fit layers.