不溶性阳极溶铜块在VCP直流电镀工艺应用研究

Research on the dissolve copper block application of insoluble anodized in VCP direct current plating process

随着PCB的快速发展,PCB向着线路越来越精细、厚径比越来越高发展。直流可溶性阳极VCP(Vertical Continuous Plating)线深镀能力不足,后期板面均匀性差等问题难以满足现在生产需求。本文从VCP发展历史开始,讲述不溶性阳极溶铜块技术结构和工作原理。并与传统的磷铜球VCP直流电镀、不溶性阳极溶氧化铜粉VCP直流电镀工艺做分析对比。该技术迭代加速产业升级,赋能PCB制造业高质量发展。

With the rapid development of PCB,PCB is developing towards more and more fine lines and higher and higher thickness-diameter ratios.The depth capacity of DC soluble anode(VCP Vertical Continuous Plating)line is insufficient,and the poor uniformity of the board surface in the later stage is difficult to meet the current production needs.This paper starts from the development history of VCP and describes the technical structure and working principle of insoluble anodized copper blocks.It is compared with the traditional phosphor copper ball VCP DC plating process and Insoluble anodized dissolved copper oxide powder VCP DC plating process.The iteration of this technology accelerates industrial upgrading and empowers the high-quality development of the PCB manufacturing industry.