水平沉铜树脂塞孔板盖帽不良影响因素研究

Study on the problem of cover copper with resin plugged hole PCB in horizontal PTH

树脂塞孔板通过沉铜板电等流程制作,将塞孔位置镀上一层铜,用于满足PCB后续产品的焊接,当沉铜不良,则会导致后续树脂上无法镀上所需的铜,影响PCB焊接,而影响沉铜不良的因素主要有化铜活性、活化Pd不良、沉铜药水与树脂不匹配等因素,文章主要通过实验和过程确认,验证树脂塞孔沉铜不良的品质影响因素,为能更好地解决因盖帽不良造成的报废,现从多个角度分析影响树脂塞孔盖帽不良的因素,找出最佳生产参数,有效地实现了树脂塞孔盖帽不良问题的改善。

PCB with resin plugged hole uses PTH and panel plating processes to cover the hole area with copper for various purpose of PCB end use.When the PTH process failed,it will sabotage copper being plated on resin,and affect PCB soldering process.Factors influence the quality of PTH includes chemical activity,poor activation of palladium,mismatch between PTH chemical and resin,etc.By experimenting and doing processes study,this article verified the factors influencing PTH quality,in order to reduce the amount of scrap board the scrap caused by bad capping.This article investigated the factors affecting the capping performance of resin plug holes,and come up with the optimized production parameters,which effectively improves the problems of resin plug holes capping process.