挠性电路板的弯折性能研究

The bending property research of flexible printed circuit

近年来,随着折叠屏手机、机器人、AR、VR等产品的快速发展,对柔性线路板(FPC)的弯折性能有着越来越高的要求,满足FPC的各种特殊应用场景。而FPC弯折性能的影响因素众多,目前对此缺乏系统的研究。因此,本文研究了介质层力学性能、叠构、线宽线距、样品尺寸、弯折条件等对FPC弯折性能的影响,结果发现,介质层的强度越高,并且越接近线路层,则FPC的弯折性能越高;对于产品设计,airgap结构、线宽线距越大、样品宽度越大、铜皮越宽,则有利于提高FPC的弯折性能。最后,对弯折条件进行研究,发现弯折角度越大、负重越大、线路面外弯折,弯折次数也越少。通过以上的研究,希望能够为制作耐弯折的FPC提供一些思路和启发。

As the rapid development of foldable phone,robot,AR,VR etc.in recent years,the demand of bending property of FPC also becomes higher and higher.Actually,there are many factors influencing the bending property,but less in-depth research has operated in this aspect.Therefore,this work is carried out to study the relationship between bending property and the factors including mechanical property,overlay,line width and line spacing,sample size,bending conditions.The result reveals that the higher strength dielectric layer and the closer distance between dielectric layer and copper line layer make positive contribution to more excellent bending property.As for the FPC design,airgap structure,wider copper line width and line spacing,and wider copper foil outside the copper line can all improve the bending property.When comes to the bending conditions,it has found that the bigger bending angle,the heavier bear load,and the side of copper line bending outward all reduce the bending life.Through this work,it is expected to provide some ideas and thoughts for manufacturing outstanding bending-resistant FPC.