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多个空腔软硬结合板层间可靠性影响因素研究

Study on the influencing factors of interlayer reliability of multiple airgap flex-rigid board
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摘要 多个空腔结构压合,意味着高层数和高厚度的台阶差,带来了层间失压和分层风险,此类产品制作难度极大。本文以20层、6个空腔软硬结合板产品进行实验,以不同空腔数量、不同基材、不同黏结片、不同棕化处理因素对比层间可靠性影响,发现空腔数量影响最大,其次为基材类型,而黏结片类型和棕化处理影响最小。此发现为多个空腔软硬结合板产品设计提供了依据,为提升产品的层间可靠性指明了方向。 The compression of multiple airgap structures means that the step difference of high level number and high thickness brings the risk of loss ofpressure and stratification between layers,and the production of such products is extremely difficult.In this paper,20L and 6 airgap of flex-rigid board were tesed,and different airgap,different substrates,different bonding sheets and different browning treatment factors were used to compare the impact of interlayer reliability.It was found that the number of airgap had the greatest impact,followed by the type of substrate,and the type of bonding sheets and exploration treatment had the least impact.This finding provides the basis for the design of multiple airgap flex-rigid board,and points out the direction for improving the interlayer reliability of products.
作者 朱光远 肖璐 Zhu GuangYuan;Xiao Lu(SHENGYI ELECTRONICS CO.,LTD.DongGuan 523127,Guangdong,China)
出处 《印制电路信息》 2023年第S02期126-136,共11页 Printed Circuit Information
关键词 可靠性 多个空腔 分层 软硬结合板 Reliability Multiple Airgap Delamination Flex-Rigid Board
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