基于mSAP工艺转移加工精细线路

Fine line processing based on mSAP process transfer

改良半加成制程(mSAP)广泛应用于IC载板领域。与减成法制作图形不同,mSAP通过电镀工艺加成制作图形,可以实现更加紧密的布线,使其逐渐在制作高精密电路板领域得到应用。然而mSAP还存在许多技术难点,闪蚀工艺就是其中之一,电镀后对基铜的闪蚀直接决定了线路的品质。由此本文探索了一种新的思路,电镀后进行压合再闪蚀,在mSAP基础上对图形进行转移加工,有望拓展mSAP的应用前景。

Modified Semi-Additive Process(mSAP)is widely used in the IC board field.Unlike the subtraction method of producing graphics,mSAP produces graphics through the addition of plating process,which can achieve tighter wiring and make it gradually used in the field of producing high-precision circuit boards.However,mSAP also exists many technical difficulties,etching process is one of them,the etching of the base copper after plating directly determines the quality of the line.This work explores a new way of thinking,plating after pressing and then etching,in mSAP based on the transfer of graphics processing,to expand the application prospects of mSAP.