铜柱法协同高导热介质提升和封装基板散热能力提升研究

Research on improving the heat dissipation ability of packaging substrates by copper post technology collaboration with high thermal conductive dielectric

本文介绍了一种封装基板散热效能提升方案,通过同时采用高导热封装基板材料和铜柱法工艺,实现封装基板的热导率得到显著提升。本研究的重点是封装载板的热性能,从基板材料和封装基板工艺制备的角度出发,对高导热率封装基板材料进行工艺的可靠性分析和实验验证。此外,还提供了封装基板材料的热导率和相应封装载板产品的热扩散系数测试方法及测试结果的讨论。同时,对比研究了高导热率的封装基板材料和传统的封装基板材料分别应用于与铜柱法工艺和激光工艺。实验结果表明,由于铜柱法可以实现实心互联结构且侧壁光滑,高导热率封装基板材料结合铜柱法可实现最优的散热效果,对应的封装载板产品的热扩散系数和热导率较传统的封装基板材料分别提升60%和2.6倍,在未来芯片和模组封装热管理中具备显著的优势和潜力。

This paper presents an approach to enhance the thermal performance of packaging substrates by utilizing high thermal conductivity materials and copper pillar technology simultaneously.The primary focus of this study is to investigate the thermal properties of the packaging carrier board.It begins by examining the substrate materials and the process involved in preparing packaging substrates,aiming to analyze the reliability of the process for high thermal conductivity materials and experimentally validate it.Moreover,a comprehensive overview of testing methods and results is provided for the thermal conductivity of the packaging substrate materials and the thermal diffusion coefficient of the corresponding packaging carrier board products.Furthermore,a comparative study is conducted to evaluate the application of high thermal conductivity materials and conventional packaging substrate materials with copper pillar technology and laser technology,respectively.The experimental findings demonstrate that the combination of high thermal conductivity packaging substrate materials and copper pillar technology,which enables a solid interconnection structure and smooth sidewalls,achieves optimal heat dissipation performance.Notably,the thermal diffusion coefficient and thermal conductivity of the corresponding packaging carrier board products are enhanced by 60%and 2.6 times,respectively,compared to traditional packaging substrate materials.These results highlight the significant advantages and potential for future chip and module packaging in terms of thermal management.