软硬结合板软板分层问题研究

The study of delamination between flex copper and resin of rigid-flex PCB

软硬结合板作为一种特殊的互联技术,同时具备FPC的可弯折性以及PCB的支撑性,弯折性能是软硬结合板的一个重要特性,根据不同的弯折性要求,软板铜可选择压延铜与电解铜。在软硬结合板制作过程中,软板铜与树脂之间出现分层是一种常见的失效模式。为了增强软板铜与树脂之间的结合力,通常会对软板进行棕化处理,由于压延铜与电解铜由于晶格不同,压延铜表面粗糙度小于电解铜,棕化药水对压延铜的粗化效果弱于电解铜,也导致压延铜与树脂之间的分层问题更多。本文旨在研究不同棕化线速、不同棕化药水、不同半固化片类型.

As a special interconnection technology,Rigid-flex PCB has the bendability of FPC and the support of PCB.Bendability is an important characteristic of rigid-flex PCB.According to different bendability requirements,the copper can be selected as RA copper or ED copper.The delamination between copper and resin is a common failure mode in the fabrication of rigid-flex PCB.In order to enhance the bonding force between the copper and the resin,the flex board is usually browned.Due to the different lattice between the RA copper and the ED copper,the surface roughness of the RA copper is smaller than that of the ED copper,and the effect of the brown-oxide liquid medicine on the coarser of the RA copper is weaker than that of the ED copper,which also leads to more delamination problems between the RA copper and the resin.This paper aims to study the effect of different brown-oxide line speed,different brown-oxide liquid medicine,Different Prepreg types on the binding force between copper and resin,and find out the method to solve the problem of delamination between copper and resin.