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不对称软硬结合板翘曲改善探讨

The improvement of warpage in rigid-flex board
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摘要 由于软板材料与硬板材料热膨胀系数差异较大,当两者以不对称结构压合时,往往产生翘曲不良。本文通过实验发现,以不同残铜率、调整压合程序、层压等方式对翘曲无明显改善,而更改硬板层叠层则可明显改善翘曲。此发现为设计不对称软硬结合板产品时提供了依据,避免产品在制作过程中出现翘曲不良。 Due to the large difference in CTE between PI and FR4,when the two materials are pressed together in an asymmetric structure,poor hyper buckling often occurs.In this paper,it is found through experiments that different residual copper chambers,adjusting the pressing procedure,and the finished product back pressure have no obvious improvement on the hyper curvature,while changing the hard plate lamination can obviously improve the warpage.This finding provides a basis for the design of asymmetric rigid-flex board to avoid the appearance of poor crown curvature in the production process.
作者 朱光远 肖璐 Zhu GuangYuan;Xiao Lu(SHENGYI ELECTRONICS CO.,LTD.DongGuan 523127,Guangdong,China)
出处 《印制电路信息》 2023年第S01期311-319,共9页 Printed Circuit Information
关键词 不对称软硬结合板 翘曲 Asymmetric Flex-Rigid Board Warpage
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