刚挠结合板模拟回流焊后分层改善分析

Analysis on delamination improvement of rigid-flex after simulated reflow welding

本文记录了某款刚挠结合板在模拟回流焊测试后出现的分层异常,并进行分层改善分析。通过FA分析,确认回流后分层为层压分层,对比层压生产加工流程、层压参数、材料叠层差异等,找到造成层压分层的显著因子——上压温度点。针对显著因子设计试验进行专项改善,成功改善层压分层问题。

This paper records the delamination abnormality of a rigid-flex board after the simulated reflow soldering test,and conducts delamination improvement analysis.Through FA analysis,it is confirmed that the stratification after reflow is the laminated layer.It compared the lamination production process,the compression parameters,the difference of the material lamination,etc.,and found the significant factors that cause the lamination-the upper pressure temperature.Special improvements were made for the significant factorial design experiment and successfully the problem of lamination delamination was improved.