IC载板mSAP工艺的化学镀铜性能研究

Electroless copper plating performance study of the mSAP process for IC substrate

mSAP工艺是在半加成法的基础上进行改良而得的一种制作精细线路的IC载板制作技术,随着轻薄化的发展及国产化趋势,IC封装载板在国内的需求也越来越大。本文介绍一种性能优异、高效、低应力及不含氰化物的环保型mSAP化学镀铜解决方案,实现了BT类载板的mSAP工艺金属化制程。研究了添加剂对化学镀铜结晶形貌的影响,同时介绍使用我司的化学镀铜和电镀药水进行BT类载板的孔金属化情况,并测试了其载板的可靠性。

The mSAP process is a modification of the semi-additive method for the fabrication of IC substrate with fine lines.With the development of thin and light weight and the trend towards localization,IC substrate is also increasingly in demand in China.This paper presents a high performance,efficient,low stress and cyanide free environmentally friendly mSAP electroless copper plating solution for plating through hole of BT substrate.The effect of additives on the crystalline morphology of electroless copper plating is investigated,and the reliability of the BT substrate is tested using the electroless copper plating solution and electroplating solution for plating through hole.