垂直连续电镀不同阴阳极回路设计对比分析

Comparative analysis of different anode and cathode circuit designs in vertical continuous electroplating

随着半导体封装基板向高密度、高精度等方向发展,电镀工艺也从减成法全板电镀转变为加成法图形电镀,为了在保证高产能的同时确保精细线路的均匀性以及品质的可追溯性,对封装基板的图形电镀提出了更高的挑战。文章针对垂直连续电镀的不同阴阳极回路设计,分析其结构,电流回路及产品跨槽时的电流切替,并结合实际应用中产品出现的问题,阐述了不同回路在可追溯性、产能、电流控制精度、线路均匀性、成本以及发生异常对产品影响程度等几个方面各自的优缺点,为设备选型和生产提供参考依据。

With the development of IC substrate towards high density and high precision,electroplating process has also changed from panel plating with subtractive process to pattern plating with Modified Semi-additive Process.In order to ensure high production capacity and ensure the uniformity of fine lines and quality traceability,pattern plating of IC substrate has put forward higher challenges.Based on the design of different anode and cathode circuits for vertical continuous electroplating,this paper analyzes its structure,current circuit and current switching when the product is moved from one cell to another,and combines the problems in practical application.The advantages and disadvantages of different circuits in traceability,production capacity,current control accuracy,line uniformity,cost and the degree of influence of abnormal occurrence on products are expounded,so as to provide reference for equipment selection and production.