高阶深微盲孔的加工及其与高纵横比通孔的共镀工艺研究

Research on processing of high-step blind vias and simultaneous plating process with high-aspect-ratio through-holes

为顺应电子产品微型化、多功能化的发展趋势,印制电路板的集成度也进一步提升,微小导通孔(盲孔、小孔径通孔)的孔金属化工艺作为实现高密度的关键加工环节已成为行业内的研究热点。文章介绍了控深钻+激光钻组合工艺加工L1~Ln高阶深微盲孔的方法,并总结了加工过程中的品质管控要点。同时,文章针对设计有127μm盲孔、L1~Ln高阶深微盲孔与21:1高厚径比通孔的测试板进行了通盲共镀工艺的加工方法及参数的研究。最后,文章对完成全制程加工的测试板进行了一系列信赖性测试,测试结果均满足IPC标准要求。

In order to comply with the development trend of miniaturization and multi-function of electronic products,the integration level of printed circuit boards has also been further improved.The hole metallization process of tiny vias(blind vias,through-holes),as a key processing link to achieve high density,has become a research hotspot in the industry.Here,the author introduced the method of processing L1-Ln high-step blind vias by the combined process of controlled depth drilling and laser drilling,and summarize the key points of quality control in the processing process.Meanwhile,for the test board designed with 127μm blind vias,L1~Ln high-step blind vias and 21:1 high-aspect-ratio through-holes,the author conducted research on the processing methods and parameters of the simultaneous plating.Finally,a series of reliability tests were performed on the test boards that have completed the full-process processing,and the test results all meet the requirements of the IPC standard.