激光钻机加工高精度盲槽研究

Study on processing high precision blind slot by laser drilling

随着电子产品的小型化和集成化不断提高,埋置元器件设计不断涌现,对基板的盲槽形状和尺寸公差要求不断提高。受制于机器精度,传统的机械加工方式已无法满足需求。而激光钻机的精度远高于传统机械加工设备,本文研究了激光钻机加工高精度盲槽的方法。采用蚀刻开窗限定盲槽孔外围尺寸,再使用激光钻机去除开窗处基材形成盲槽,槽体尺寸精度和位置精度可达到±0.05 mm,深度可控制在±0.03μm。文章不但对激光烧槽参数进行了优化,并且提出了机械加工与激光钻机加工结合的制作方式,在保证精度的同时提高了效率。

With the improvement of the miniaturization and integration of electronic products,there are more and more embedded components design.The requirements for the slot shape and dimensional tolerance are more and more rigorous.Limited by machine precision,traditional machining processing methods cannot meet the demand.In this paper,the method of processing blind slot by laser drilling is studied because the precision of laser drilling is much higher than that of traditional machining equipment.The etching opening is used to define the blind slot outline,and then the base material at the opening is removed from the blind slot by laser drilling.The dimension accuracy and position accuracy of the slot can reach±0.05mm.The depth accuracy can reach±0.03mm.The parameters of laser were studied.Then the method of combining machining with laser drilling is proposed to reduce the cost.