高多层印制电路板高对准度研究

Study on high alignment of high multilayer printed circuit board

随着电子电路行业技术的迅速发展,元器件的集成功能日益广泛,电子产品对印制电路板的高密度化要求更为突出,高多层板、挠性版、HDI板和封装基板等高端PCB产品逐渐占据市场主导地位。高多层印制板的加工难度大、品质可靠性要求高,主要应用于通讯设备、工控、安防、高端服务器、医疗电子、航空、军事等领域。而影响高多层印制板性能最大的其中一个点为对准度,文章通过一款26层印制板的制作研究,提出一些制作建议。

With the rapid development of electronic circuit industry technology,the integrated functions of components are becoming increasingly extensive,the high density requirements of electronic products for printed circuit boards are more prominent,and high-end PCB products such as high multi-layer board,flexible plate,HDI board and packaging substrate gradually occupy the dominant position.High and multi-layer printed board is difficult to process and requires high quality and reliability.It is mainly used in communication equipment,industrial control,security,high-end server,medical electronics,aviation,military and other fields.One of the points that affects the performance of high multilayer printed board is the alignment.This paper makes some suggestions for the production of a 26-layer printed board.