112Gbps高速材料板内层互连缺陷问题探究

Study on inner connection defect of 112 Gbps high speed material

随着5G网络的扩展和6G技术发展快速推进,传输速率需求也从56 Gbps逐步攀升到112 Gbps,各板材生产商也陆续推出112 Gbps级别的高速材料。因112 Gbps高速材料相比56 Gbps高速材料的树脂体系发生变化,在板材认证过程中发现不同材料厂商推出的112 Gbps级别的高速材料均发现内层互连缺陷(Inner Connection Defect,以下简称ICD)问题。文章将探究产品结构、钻孔及除胶工序对ICD产生的影响,通过试验验证的方法解决改善该级别高速材料的ICD问题,为112Gbps高速材料的加工提供技术参考。

With the expansion of 5G network and the development of 6G technology,the transmission rate demand has also been rising from 56 Gbps to 112 Gbps,and the manufacturers of the copper clad laminate manufacturer have launched 112 Gbps high-speed materials.Because the resin system of 112 Gbps high-speed material has changed compared with 56 Gbps high-speed material,it is found that the ICD problem is found in the 112 Gbps high-speed material launched by different material manufacturers during the plate certification process.This paper will explore the impact of product structure,drilling and desmear gprocess on ICD,solve the ICD problem of this level of high-speed material through experimental verification,and provide technical reference for the processing of 112 Gbps high-speed material.