嵌入式埋铜块产品平整度改善研究

Research on improvement of flatness of embedded copper block products

贯穿式埋铜块产品为SME新开发的产品工艺和产品类型,因在初期的开发和生产中对该类产品的掌握不够,初始阶段出现一些比较明显的过程缺陷,需要我们及时的研究改善。文章中讲述了一个6层板贯穿式埋铜块产品外层平整度不良缺陷,通过前后阶段的分析确定导致缺陷产生点为层压工序,试验确认导致板面凹痕和不平整的原因为层压叠板中缓冲材料的选择不够准确和科学。经过试验确认了改善方法和改善方向,并应用到批量板生产中,收到明显的改善效果。

Buried resistor copper foil products have a variety of resistance designs.The width of the resistance line ranges from 0.1mm to 0.4mm.The resistance accuracy requirements are getting higher and higher.The types of resistance copper foils used are also diverse.Different copper foils are processed.There are big differences in performance,resistance layer characteristics and process capabilities,and different resistance copper foils have different sensitivity to the roughening syrup before pressing,and the influence of the pressing process on the resistance value is also different.As a result,the final resistance accuracy and stability will have a big difference.This article analyzes the influence of different types of resistance copper foils,multiple line width designs,and factors before and after the pressing process,and analyzes their square resistance values presenting intervals and changing laws,providing a data basis for the production of product boards and guiding product compensation design,which avoided the influence of resistance size design deviation or different process selection on the accuracy of buried resistance in advance,and improved resistance production accuracy and resistance yield.