一种阶梯板制作技术研究

Research on manufacturing technology of a stepped plate

阶梯板的阶梯槽在封装时能容纳部分元器件,当槽底部设计有线路焊盘时则能参与封装贴件;因此阶梯板能实现整体体积小型化,加大产品组装与封装密度,以达到节省板面空间的作用。文章通过研究一款6层集N+N结构压合、机械盲埋孔、控深铣、激光切割、电厚金的阶梯板为例;就其结构设计、制程工艺、制作难点及改善措施进行分析研究。

The step slot of the step board can accommodate some components during packaging,and can participate in packaging and pasting when the circuit pad is designed at the bottom of the slot.Therefore,the step board can realize the miniaturization of the overall volume and increase the product assembly and packaging density,so as to save the board space.This paper chose a 6-layer ladder plate with N+N structure pressing,mechanical blind hole embedding,depth controlled milling,laser cutting and electric thick gold,etc.The structural design,manufacturing process,manufacturing difficulties and improvement measures are analyzed and studied.