封装载板内置电镀散热金属块技术

Plated heat spreader module technology in IC substrate

文章介绍一种电镀散热金属块制作技术,涉及电子电路、半导体芯片封装领域。通过在电子电路的芯片封装区域内电镀大面积散热金属块,在三维方向上布设立体贯通的实心金属散热通道以增强芯片的散热性能。本技术基于珠海越亚铜柱法专利技术,可依据产品的散热需求来对金属块的位置、形状、大小进行客制化设计,并通过图形转移和电镀工艺实现,具有较高的设计灵活性和匹配性;金属块的厚度是通过电镀和磨板控制,通过相关DOE测试与验证,具有良好的表面平整性及厚度均一性。通过在电子电路内电镀散热金属块,可将封装在电子电路上的元器件运行时产生的热量快速散发,有效降低元器件的工作环境温度,提高元器件运行的性能稳定性和可靠性。在当前半导体封装器件趋于高频高速、高功率、高运算量而追求高散热的背景下,本技术可提供优良的散热解决方案并已经广泛商业应用。

This paper introduces a technology of PHS(Plated Heat Spreader),which involves the fields of electronic circuits and semiconductor chip packaging.By plating a large-area heat-spreading metal block in the chip packaging area of the electronic circuit,a solid metal heat-spreading channel is arranged in a three-dimensional direction to enhance the heat-spreading performance of the chip.This technology is based on the Copper Pillar Method patent of Zhuhai ACCESS.The position,shape and size of the metal block can be customized according to the heat spreading requirements of the product,and realized through pattern transfer and plating process,with high design flexibility and compatibility.The thickness of the metal block is controlled by plating and grinding process,with good surface flatness and thickness uniformity after the relevant DOE tests and verifications.By electroplating heat-spreading metal blocks in the electronic circuit,the heat generated by the components encapsulated on the electronic circuit can be quickly spread,effectively reducing the working environment temperature of the components,and improving the performance stability and reliability of the components’operation.Under the background that the current semiconductor package devices tend to be high frequency,high speed,high power,and high computing volume and pursue high heat dissipation,this technology can provide an excellent heat dissipation solution and has been widely used in commercial applications.