软硬结合板软板压痕、软板流胶研究

The study of resign flow indentation for rigid-flex PCB

电子产品的发展趋势要求印制电路板沿着“轻、薄、短、小”及多功能化方向发展,而软硬结合板以其尺寸小、重量轻、可避免连线错误,增加组装灵活性,实现三维立体组装等优点,将成为印制电路板发展的一个重要方向。由于软硬结合板需要兼顾软板与硬板的特点,在软板区有贴覆盖膜/保护胶带设计,同时为方便揭盖在硬板材料又存在半固化片开窗/开槽设计,软硬交接位的设计较为复杂,导致该区域的缺陷(软板流胶、软板压痕)通常成为软硬结合板的主要报废问题。文章主要通过对软硬结合板的叠构设计研究,改善软硬结合板软板区域的主要缺陷,保证软硬结合板的产品质量符合客户诉求。

The development trend of electronic products requires the PCB towards the direction of light,thin,short,small and multi-functional.Rigid-flex PCB with small size,light weight,can avoid wiring error,increase the flexibility of assembly,achieve three-dimensional assembly and other advantages,which will become an important direction of the development of PCB.Due to Rigid-flex PCB need to juggle with the characteristics of the PCB and FPC,there are CVL and Tape design on flex area,and PP window/slot design on prepreg.The design of R-F line is complex,which leads to the defects in this area(resign flow,indentation)and often becomes the main defects of Rigid-flex PCB.In this paper,the main defects of the flex area are improved through the fold structure design research of Rigid-flex PCB,which ensures the product quality of Rigid-flex PCB to meet the customer demands.