任意层HDI板层压变形与对位模式研究

Study of lamination deformation and alignment mode for anylayer HDI board

随着任意层产品设计越发精细及复杂化,任意层产品对位要求越来越高。影响对位效果主要因素之一就是层压变形。文章通过研究不同板边假铜设计、高膨胀系数钢板的应用来实现层压变形量的改善;以及通过对位标靶位置优化与分区对位模式应用,最终达到改善镭射盲孔崩孔的效果。

As the any layer product design becomes more and more refined and complex,the alignment requirements of any layer are higher and higher.One of the main root causes affecting the alignment effect is lamination deformation.In this paper,the improvement of lamination deformation is realized by studying the design of different dummy copper pattern on board edges and the application of high expansion coefficient steel plate.And in the study of lamination deformation trend,through the optimization of location target position and the application of partition alignment mode,the effect of improving laser via broken is finally achieved.