IGBT模块挠性化大电流传输设计及制作研究

Design and fabrication of flexible high-current transmission for IGBT modules

在未来,热管理将在设计和制造中发挥关键重要的作用,因为电子设备的小型化和多功能性的快速发展导致了功率密度的巨大增加。由于挠性印制电路板扁平导线比相同横截面积的圆导线具有更大的表面积从而提供了更大的散热和更高的载流能力,因此发展应用高导热、高热流、高稳定性、高可靠性的挠性板是必然趋势。文章介绍了一种将挠性板应用到大功率器件的新型封装方式,结合多物理场仿真软件COMSOL,根据器件工作的热要求对挠性板的线宽、线距、铜厚等方面进行了热仿真研究,设计出满足大功率器件IGBT工作要求的挠性板,最后比较了通过大电流下超声引线键合和挠性互连的热分布。通过制作样品测试,验证了新的封装方式可以很好的改善IGBT的热分布,大大提高了其功率循环能力。

In the future,thermal management will play a key role in design and manufacturing as the rapid development of miniaturization and versatility of electronic devices has led to a huge increase in power density.Since the flat conductor of the flexible printed circuit boards has a larger surface area than the circular wire of the same cross-sectional area,it provides greater heat dissipation and higher current carrying capacity.It is an inevitable trend to develop and apply flexible boards with high thermal conductivity,high heat flow,high stability and high reliability.This paper introduces a new packaging method that applies a flexible board in high-power device.According to the thermal requirements of device operation,combined with multiphysics simulation software,the line width,line spacing,copper thickness and other aspects of the flexible board are studied,and a flexible board is designed to meet the working requirements of high-power device IGBT.Finally,the thermal distribution of ultrasonic lead bonding and flexible interconnects under high currents is compared.By making samples for testing,it is verified that the new packaging method can improve the heat distribution of IGBT and its power cycling capability.