基于高厚径比的5G通讯PCB微型钻针失效工艺研究

Analyzing micro drill point failure based on 5G communication PCB products with high aspect ratio

文章针对高厚径比的5G通讯PCB产品的微型钻针失效原因进行了系统分析,并输出了有效改善措施,实现了0.15 mm孔径、厚径比30:1的钻孔加工能力。基于钻针的受力分析,锁定了断钻的根因为排屑不良。通过对钻针三维结构进行数学建模,优化了钻针结构,提升了70%的排屑能力。工艺方面综合研究了钻机分步类型、预钻工艺对断钻的影响,并通过DOE锁定了最优钻孔参数。

This paper systematically analyzed the failure reasons of micro drill point of 5G communication products with high aspect ratio(AR),and worked out an effective improvement methodology which achieved the drilling capacity for AR30:1 with 0.15 mm minimum bore diameter.Based on drill point force analyzing,the primary cause of the broken drill point was identified as poor chip removal.By mathematical modeling the 3D structure of drill point,the design of drill point has been optimized and,in consequence,promoted 70%of chip removal capacity.In terms of technological process,it analyzed synthetically the effects of step type of drilling,as well as the influence of pre-drilling technology on broken drill point.In addition,it used DOE to determine the optimal drilling parameters.