摘要
研究了树脂调胶顺序以及压合工艺参数对树脂团聚的影响情况。结果表明,当在树脂调胶时先将相互亲和性较低的物质混合后再加入亲和性高的物质,树脂团聚情况将从外观目视可见明显沟壑改善至外观目视无异常;当层压程序的升温速率降低和最大压力减少,树脂团聚的发生比例会降低,树脂团聚的尺寸变小。
An investigation of how the resin reunion is influenced by resin blending sequence and lamination program was carried out.It found that during the resin mixing,mixing the low-affinity materials firstly and then blending high-affinity material the resin reunion severity was reduced from visible to invisible.When the heat up rate and the full pressure of the lamination program were reduced,the occurrence and the size of the resin reunion could be reduced.
作者
邓梓健
彭伟
唐海波
黄俊辉
Deng Xinjian;Peng Wei;Tang Haibo;Huang Junhui
出处
《印制电路信息》
2022年第S01期313-320,共8页
Printed Circuit Information
关键词
印制电路板
树脂团聚
可靠性
树脂调胶
压合工艺改善
PCB
Resin Reunion
Reliability
Bismaleimide/cyanate Resin
The Lamination Process Improvement