16层任意阶互联PCB研究

The research of 16L anylayer PCB

任意层互联线路板广泛应用于高阶手机产品,目前市场上用于手机主板的最高阶为12层任意阶。随着手机端产品的不断发展,阶数可能还会上升,为此,我们前期已经研发了14层、16层任意层产品。文章主要针对16层任意层产品研发过程中的风险点进行提前识别,对16层任意层产品相关信赖性进行验证,同时将研发过程中发现的问题进行分享,以便同行参考借鉴。

Anylayer interconnection circuit board is widely used in high-end mobile phone products.At present,the highest level used for mobile phone motherboard in the market is 12 layer arbitrary level.With the continuous development of mobile phone products,the layer may rise.Therefore,the company has developed 14 layer and 16 layer products in the early stage.This paper mainly identifies the risks in the R&D process of any layer of 16 layer products in advance,verifies the reliability of Anylayer of 16 products,and shares the problems found in the R&D process for peer reference.