任意层HDI板芯板层对位标靶技术研究

Study of alignment technology on core registration for any layer HDI board

随着布线密度和盲孔密度增加,任意层HDI板的盲孔和通孔的焊盘尺寸越来越小,对层间对准和板整体对准的要求越来越高,传统的逐层对位系统已经很难满足。文章根据任意层HDI板厚度趋薄的特点,研究了增层介质采用1027(半固化片)时,标靶全部设置在芯板层的对位方法。通过优化各层的对位标靶,得到盲孔最佳对准度为35μm,通孔最佳在对准度为100μm。

With the increasing of wiring density and blind via density of any-layer HDI board,the pad size of blind via and through holes are become smaller and smaller,so the alignment for layer to layer and overall board become more and more difficult.The traditional registration way,layer by layer alignment system,has been difficult to match with it.According to the thinner trend of any layer HDI plate thickness,this article studied a new alignment system that sets all registration marks on the core plate when 1027 pp is used.By optimizing the alignment target of core and build up layer,the best alignment of blind via is 35μm and through hole is 100μm respectively.