摘要
无源器件埋嵌技术是解决电子封装高频化寄生效应、尺寸小型化等重要方法。文章采用化学镀的方法,在镀液中引入DETA(Diethylenetriamine)并分析了DETA(Diethylenetriamine)的含量、温度、pH、电阻沉积区域对薄膜电阻性能的影响,得到了高电阻NiPC薄膜材料,结果表明其方块电阻可达到731Ω/sq,是镍磷方块电43倍,此外通过在线监控的方法,实现集成电阻误差控制在5%以内的目标,远高于现有蚀刻Ni-P薄膜15%的误差。集成电阻使用层压、TCR测定等试验分析电阻器的结合力和温度变化对电阻的影响。得出高结合力、低TCR等优点。
Embedding Passive technology is an important method to solve the parasitic effects of high-frequency electronic packaging and high density.In this paper,electroless plating is used,DETA(Diethylenetriamine)is added into the plating solution and the influence of DETA(Diethylenetriamine)content,temperature,pH,and resistance deposition area on the performance of thin film resistors is analyzed.High-resistance NiPC thin film material is obtained.It shows that the sheet resistance can reach 731Ω/sq,which is 43 times that of Ni-P sheet resistance.In addition,through online monitoring,the integrated resistance error is controlled within 5%,which is much higher than the existing etching Ni-P film 15%error.The integrated resistor analyzes the bonding force and effect of temperature changing on resistance by lamination and TCR measurement.The results show that the advantages of high bonding force with prepreg and small resistance temperature coefficient.
出处
《印制电路信息》
2021年第S02期243-250,共8页
Printed Circuit Information
基金
珠海市创新创业团队项目(No.ZH0405190005PWC)
广东省科技计划项目(No.2019B090910003)
珠海市项目(No.ZH22044702190033HJL)的资助
