高频液晶聚合物与铜层压结合工艺中等离子处理的应用研究

Application of plasma treatment in the combination process of flexible LCP and copper lamination

随着第五代通讯技术的发展,液晶聚合物(Liquid Crystal Polymer,LCP)基材的挠性印制电路(Flexible Printed Circuit,FPC)在多种场合有着重要的应用前景,其相较其他挠性基材具有较低的介电常数和介电损耗因子,同时具有低吸水率的良好特性,但它化学性质稳定,与铜箔的直接结合较为困难,结合力比较差。文章提出了一种全新的无胶处理提升LCP层与铜层之间结合力的方法,重点讨论等离子处理LCP对最终剥离强度的影响,并分析了这一结果产生的原因。实验发现,当使用纯氧气等离子处理LCP基材,处理功率为6 kW时,剥离强度测试结果最好,可达8.92 N/cm。随后,文章使用水接触角测试、扫描电子显微镜(SEM)、傅里叶红外光谱分析(FTIR)等表征测试手段探寻了结合力提升的原因。

With the development of the fifth generation communication technology,Flexible Printed Circuit(FPC)based on Liquid Crystal Polymer(LCP)has become an important application prospect in many applications.Compared with other flexible substrates,it has lower dielectric constant and dielectric loss factor,and has good characteristics of low water absorption,but its chemical properties are stable,and it is difficult to directly combine with copper foil,and the binding force is poor.In this paper,a new method of adhesive-free treatment to improve the peel strength between LCP layer and copper layer is proposed.The influence of plasma treatment of LCP on the final peel strength is discussed,and the reasons for this result are analyzed.It was found that when the LCP substrate was treated with pure oxygen plasma and the processing power was 6 kW,the peel strength test results were the best,up to 8.92 N/cm.Then,this paper used water contact angle test,scanning electron microscopy(SEM),Fourier transform infrared spectroscopy(FTIR)and other characterization methods to explore the reasons for the improvement of peel strength.