CAF可靠性问题失效分析方法研究

Study on failure analysis method of CAF reliability problem

随着电子产品高密度、小型化的快速发展,印制板导体间距越来越小,CAF失效的几率越来越高,成为影响产品可靠性的重要因素。如何有效分析出CAF失效模式成为业界的技术难题。文章通过详细介绍CAF失效分析方法,寻找失效点,找出失效根因,并提供多种CAF失效模式分析案例,供同行参考和借鉴。

With the rapid development of high density and miniaturization of electronic products,the hole spacing of PCB becomes more and more small,and the probability of CAF failure becomes more and more high,which becomes an important factor affecting product reliability.How to effectively analyze CAF failure modes has become a technical problem in the industry.This paper introduces the CAF failure analysis method in detail,looks for the failure point,finds out the root cause of failure,and provides various cases of CAF failure modes.The author hopes it can be useful for PCB production process improvement,product reliability improvement and,work for peer reference.