射频等离子体在高速材料高纵横比的刻蚀工艺研究

Application of plasma in high speed and high aspect ratio materials

近年5G通迅、AI人工智能、军工航天、可穿戴设备等电子应用领域的迅速发展,正驱动工业对复杂的高性能电路板的需求,高输入/输出(I/O)和快速要求高密度的相互连接,导致了高密度的多层板结构,从10层到64层或更高层的高速材料电路板(PCB板)。这些高端板结构寻求高的纵横比和更小的孔径,钻孔后去钻污的传统方法受到很大的限制,由于传统湿法工艺的限制,在PCB制造工艺中形成了新的困难。液体不能渗透到非标准多层板的微孔中,传统的desmear处理工艺具有其局限性。湿式化学法,如酸蚀,对刻蚀化学惰性的介电材料有困难。利用等离子除胶可以达到常规清洗无法达到的效果,可应用在PCB制造过程中。

The rapid development of electronic applications such as 5 G communications,AI artificial intelligence,military aerospace,and wearable devices in recent years are driving the demand for complex high-performance circuit boards.High I/O and rapid requirements for high-density interconnection have led to high-density multilayer board structures,from 10 layers to 64 layers or higher,with high-speed materials PCB boards.The traditional methods of drilling and decontamination for these highend plate structures seeking high aspect ratio and smaller aperture are minimal.However,due to the limitation of the traditional wet process,new difficulties are formed in the PCB manufacturing process.The traditional Desmear process has its limitations due to the inability of liquids to penetrate the micropores of non-standard multilayer plates.Other wet chemical methods,such as acid etching,are challenging to etch chemically inert dielectric materials.Plasma degluing can achieve an effect that cannot be achieved by conventional cleaning.This article will discuss the principle of plasma and other applications in PCB manufacturing.