化学镍钯金引线键合可靠性研究

Research on reliability of enepig gold wire bonding

金线引线键合工艺基于其良好的导电性、稳定性而广泛应用于半导体封装领域。对于半导体封装载体印制线路板而言,优良的表面涂覆方式以及良好的工艺控制能力是引线键合封装良率的重要保障。文章基于行业内化学镍钯金产品在引线键合过程中的常见失效问题,通过系统的机理分析以及试验验证,探究影响化学镍钯金产品引线键合可靠性的关键因子并输出管控方案。

The gold wire bonding process is widely used in the field of semiconductor packaging based on its good conductivity and stability.For the semiconductor package carrier PCB,a suitable surface coating method and good process control ability are important guarantees for the package yield.This article is based on the common problems of nickelpalladium-gold products in the industry in the gold wire bonding process.Through the system mechanism analysis and experimental verification,it explores the key factors affecting the reliability of gold wire bonding of nickel-palladium-gold products,and has output of control plans.