摘要
由钻孔参数,钻孔工艺,电镀除胶等方面入手,对钻孔的孔内铜瘤改善进行研究,从实验结果数据表明,把钻孔参数优化最佳条件下,低进刀量钻孔参数,采用免焊孔径等大全新钻针重钻一次,电镀等离子除胶,能有校解决免焊孔的孔内铜瘤问题。
This paper picked drilling parameters,drilling technology,the electroplating degumming and other aspects,aimed to improve the drilling hole copper tumor.The data from the experiment results shew that by optimization the best conditions of drilling parameters,the author applied low feed drilling parameters,used big new holing needle like free welding aperture heavy drill and plating plasma degumming,and achieved welding hole copper tumor solution.
作者
肖坤红
黄德业
关志锋
Xiao Kunhong;Huang Deye;Guan Zhifeng
出处
《印制电路信息》
2021年第S01期256-261,共6页
Printed Circuit Information
关键词
孔内毛刺
铜瘤
Burr In Hole
Copper Tumor